Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Published in 2020 by CRC Press, this technical monograph represents a sophisticated contribution to the field of microelectronics packaging. Ephraim Suhir, a distinguished authority in the mechanics of materials, wrote this work to address the critical engineering challenges associated with solder joint reliability in integrated circuit devices. It serves as a specialized resource for mechanical and materials engineers concerned with preventing premature failure caused by inelastic strains during thermal and mechanical stress cycles.

The book builds upon the author’s extensive research into the analytical modeling of electronic components. Suhir focuses on the mathematical foundations of stress-strain relationships, aiming to provide designers with predictive tools rather than relying solely on empirical testing. Within the broader context of semiconductor reliability literature, the text is regarded as a rigorous academic deep-dive, favored by professionals working in precision engineering and high-reliability aerospace or industrial electronics.